The rise of artificial intelligence, cloud computing and large-scale data processing has driven an explosion in demand for computing power, placing thermal management of digital infrastructure at the heart of performance, reliability and energy efficiency challenges.
Drawing on more than 170 years of industrial expertise, Motul is now applying its innovative know-how to one of the defining challenges of our time: data center cooling.
With the EGEN DCC range, Motul addresses the specific requirements of these environments with two complementary immersion cooling solutions for sensitive electronic components: processors (CPU), graphics cards (GPU), RAM memory and storage solutions.
The first, EGEN DCC 100R8, targets high-compute infrastructures with a high thermal density formulation.
The second, EGEN DCC 100R5, offers an optimized formulation for mixed environments and standard OCP architectures.
Both products share optimal thermal and operational performance, including:
- Low viscosity for improved fluid circulation
- Excellent thermal properties for optimal heat dissipation
Proven resistance to corrosion and oxidation to protect equipment over the long term
Beyond performance, EGEN DCC 100R8 and EGEN DCC 100R5 address the sectors growing environmental challenges.
Formulated from bio-sourced and renewable raw materials, they significantly reduce the carbon footprint associated with industrial fluids, without compromising stability or service life.
By combining operational efficiency, thermal performance and an eco-responsible approach, these two dielectric fluids offer data center operators a coherent solution that reconciles sustainability and performance — true to Motul’s heritage.
For the full technical specifications: Technical file
